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With the rapid development of 5G communications, the Internet of Things, smart terminals, and electric vehicles, the global semiconductor market continues to expand. According to industry data, global semiconductor equipment investment surpassed USD 100 billion in 2023, with manufacturing precision and production efficiency becoming core competitive indicators.
Against this backdrop, miniature servo electric cylinders, thanks to their compact size, high precision, and modular design, are becoming a key driving force in upgrading semiconductor equipment.

Technology Analysis: Core Advantages of the Miniature Servo Electric Cylinder

A miniature servo electric cylinder is an innovative product integrating precision mechanics, servo control, and sensing technology. Featuring a small footprint, high accuracy, and large load capacity, it enables precise servo control at any position within its stroke range — including accurate position, speed, force, and hybrid force-position control. It serves as a core motion component in robots and precision electromechanical equipment for industrial automation.

Technical highlights include:

• Micron-level positioning accuracy: Using a high-precision planetary roller screw and closed-loop control technology, it achieves a repeat positioning accuracy of ±0.002 mm, meeting the stringent requirements of various precision scenarios in semiconductor manufacturing.
• Ultra-compact integrated design: Its volume is reduced to one-third of that of conventional electric cylinders, fitting the high-density integration trend of semiconductor equipment.
• Intelligent dynamic response: Supports real-time closed-loop regulation of pressure, speed, and position, enhancing process stability.
• Ultra-high power density: Within a 30 mm stroke, it can withstand a push-pull force of 250 N, breaking the bottleneck between miniaturization and high power.

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Five Application Scenarios: Empowering the Entire Semiconductor Manufacturing Process

1. Wafer Handling and Alignment
   • Precision handling: During wafer fabrication, wafers must be accurately transferred between workstations. Miniature servo cylinders ensure stability and positioning accuracy during handling.
   • Alignment operations: In photolithography and exposure, wafer alignment accuracy is critical. The cylinder provides micron-level adjustments to meet process requirements.
2. Precision Pressing in Packaging Equipment
   • Accurate pressure application: In semiconductor packaging, the cylinder applies precise pressure — for example, during wire bonding or molding — ensuring uniform force to avoid chip damage or defective encapsulation.
   • Dynamic pressure adjustment: The cylinder can adjust pressure parameters in real time to accommodate diverse packaging process needs.
3. Precision Execution in Testing Equipment
   • Probe testing: In chip test systems, the cylinder precisely controls probe movement and contact pressure, ensuring stable and accurate test data.
   • Automated module switching: It can handle clamping, releasing, or moving chip modules during testing, improving efficiency.
4. Adjustment Modules in Photolithography Equipment
   • Optical platform positioning: In lithography machines, optical platforms require precise positioning. The cylinder delivers stable linear motion and high-precision control, ensuring proper alignment of optical systems.
5. Accurate Movements in Cleaning Equipment
   • Nozzle position adjustment: During wafer cleaning, the cylinder adjusts the nozzle’s position and angle, ensuring cleaning fluid covers the entire wafer surface.